Services

We Provide:

Competitive test cost, quality and availability
Service including optical and X-ray inspection (AOI and AXI),in-circuit test (ICT) and functional test (FT) development
Assembly processes

We combine advanced processes with highly skilled resources. Our innovative techniques extend to sophisticated packaging and assembly technology, including:

Tin-lead and lead-free SMT and Wave
BGA assembly
Double-sided/single reflow processing
Fine pitch, high pin count, press fit connectors
Plated through hole (PTH) and mixed technology
Clean and no clean processes of PCBA

We provide services for both turnkey and consignment projects. Our services include Printed Circuit Board Assembly (“PCBA”), Box-Build Assembly and Printer Assembly. Our principal activities can be grouped mainly into 3 business group:

1. Printed Circuit Board Assembly (“PCB Assembly”)
The range of products under this principal activity includes industrial interface PCBA, printer IF interface, consumer product PCBA all kind of thump print PCBA, flexible circuit assembly.

2. Box-Build Assembly
The range of products include remote control system and complete set of printer assembly, Full box build capability to handle turn key project from electronic component to material sourcing to final packaging and logistical distribution.

3. Other Services
The range of other service includes product sub-assembly, we provide one shop service with flexibility in delivery with all source of order “low quantity to high volume, high quantity low volume” even to the extend of short lead time and spot order.

Thermal Printer Assembly


Head Welding Dept		Fine Head Dept


Thermal Printer Assembly		Thermal Printer Dept


Printing Inspection Process		Appearance Inspection Process


QA1 Inspection Process		Packing Process


QA2 Inspection Process